Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating: Fid-Bau Portal

Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

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Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating

Contributors:

Yoon, J.-W. (author) / Chun, H.-S. (author) / Jung, S.-B. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 1219-1229

Publication date:

2007-01-01

Size:

11 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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