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Study on Pad Conditioning Parameters in Silicon Wafer CMP Process

Zhou, Z.Z. / Yuan, J.L. / Lv, B.H. / Zheng, J.J.

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Study on Pad Conditioning Parameters in Silicon Wafer CMP Process

Zhou, Z.Z. / Yuan, J.L. / Lv, B.H. / Zheng, J.J.

Study on Pad Conditioning Parameters in Silicon Wafer CMP Process

Zhou, Z.Z. / Yuan, J.L. / Lv, B.H. / Zheng, J.J.

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Check availability in my library

Order at Subito €

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Document information

Title:

Study on Pad Conditioning Parameters in Silicon Wafer CMP Process

Contributors:

Zhou, Z.Z. (author) / Yuan, J.L. (author) / Lv, B.H. (author) / Zheng, J.J. (author) / Xu, J. / Xu, X. / Cai, G. / Kang, R.

Published in:

Advances in Grinding and Abrasive Technology XIV ; 309-313

KEY ENGINEERING MATERIALS ; 359/360

Publication date:

2008-01-01

Size:

5 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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