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    Precision wafer thinning and its surface conditioning technique

    New search for: Young, H.-T.
    New search for: Lin, C.-C.
    New search for: Liao, H.-T.
    New search for: Yang, M.
    New search for: Wang, J.
    New search for: Gao, H.
    New search for: Guo, D.
    New search for: Kang, R.

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    Precision wafer thinning and its surface conditioning technique

    New search for: Young, H.-T.
    New search for: Lin, C.-C.
    New search for: Liao, H.-T.
    New search for: Yang, M.
    New search for: Wang, J.
    New search for: Gao, H.
    New search for: Guo, D.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Precision wafer thinning and its surface conditioning technique

    New search for: Young, H.-T.
    New search for: Lin, C.-C.
    New search for: Liao, H.-T.
    New search for: Yang, M.
    New search for: Wang, J.
    New search for: Gao, H.
    New search for: Guo, D.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Precision wafer thinning and its surface conditioning technique

    Contributors:

    Young, H.-T. (author) / Lin, C.-C. (author) / Liao, H.-T. (author) / Yang, M. (author) / Wang, J. / Gao, H. / Guo, D. / Kang, R.

    Published in:

    CURRENT DEVELOPMENT IN SURFACE ENGINEERING AND TECHNOLOGIES ; 36-45

    INTERNATIONAL JOURNAL OF MATERIALS AND PRODUCT TECHNOLOGY ; 31

    Publication date:

    2008-01-01

    Size:

    10 pages

    ISSN:

    0268-1900

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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