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Optimizing maximum equivalent strain on solder balls in flip-chip packages

Wu, G. H. / Ju, S. H. / Hsu, T. C. / Lai, H. Y. / Hwang, W. M.

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Optimizing maximum equivalent strain on solder balls in flip-chip packages

Wu, G. H. / Ju, S. H. / Hsu, T. C. / Lai, H. Y. / Hwang, W. M.

Optimizing maximum equivalent strain on solder balls in flip-chip packages

Wu, G. H. / Ju, S. H. / Hsu, T. C. / Lai, H. Y. / Hwang, W. M.

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Check availability in my library

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Document information

Title:

Optimizing maximum equivalent strain on solder balls in flip-chip packages

Contributors:

Wu, G. H. (author) / Ju, S. H. (author) / Hsu, T. C. (author) / Lai, H. Y. (author) / Hwang, W. M. (author)

Published in:

POLYMER COMPOSITES ; 29 ; 229-236

Publication date:

2008-01-01

Size:

8 pages

ISSN:

0272-8397

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.192

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