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    Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

    New search for: Shohji, I.
    New search for: Shiratori, Y.
    New search for: Yoshida, H.
    New search for: Mizukami, M.
    New search for: Ichida, A.

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    Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

    New search for: Shohji, I.
    New search for: Shiratori, Y.
    New search for: Yoshida, H.
    New search for: Mizukami, M.
    New search for: Ichida, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

    New search for: Shohji, I.
    New search for: Shiratori, Y.
    New search for: Yoshida, H.
    New search for: Mizukami, M.
    New search for: Ichida, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

    Contributors:

    Shohji, I. (author) / Shiratori, Y. (author) / Yoshida, H. (author) / Mizukami, M. (author) / Ichida, A. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 45 ; 754-758

    Publication date:

    2004-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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