Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

    New search for: Huang, J. T.
    New search for: Chao, P. S.
    New search for: Hsu, H. J.
    New search for: Shih, S. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

    New search for: Huang, J. T.
    New search for: Chao, P. S.
    New search for: Hsu, H. J.
    New search for: Shih, S. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

    New search for: Huang, J. T.
    New search for: Chao, P. S.
    New search for: Hsu, H. J.
    New search for: Shih, S. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

    Contributors:

    Huang, J. T. (author) / Chao, P. S. (author) / Hsu, H. J. (author) / Shih, S. H. (author)

    Published in:

    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 10 ; 133-142

    Publication date:

    2007-01-01

    Size:

    10 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Lead-free Solder Wafer Bumping

    Dimock, F. / Mattson, K. | British Library Online Contents | 2004

    Lead-free flip chip bumping with special focus on stud bumping - a flexible and economical flip chip technology

    Norlyng, S. | British Library Online Contents | 2001

    Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

    Jang, J.-W. / De Silva, A. P. / Lin, J.-K. et al. | British Library Online Contents | 2004

    Solder Bumping - Mastering Challenges of Lead-free Alloys

    Riley, G. A. | British Library Online Contents | 2005

    Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps

    Kim, D. G. / Ha, S. S. / Jung, S. B. | British Library Online Contents | 2006

    Back to top