Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps: Fid-Bau Portal

Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps

Kim, D. G. / Ha, S. S. / Jung, S. B.

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Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps

Kim, D. G. / Ha, S. S. / Jung, S. B.

Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps

Kim, D. G. / Ha, S. S. / Jung, S. B.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps

Contributors:

Kim, D. G. (author) / Ha, S. S. (author) / Jung, S. B. (author) / Kim, H. S. / Li, Y. B. / Lee, S. W.

Published in:

Eco-Materials Processing & Design VII: Proceedings of the Conference of the 7^t^h International Symposium on Eco-Materials Processing & Design January 8-11, 2006, Chengdu, China ; 550-553

MATERIALS SCIENCE FORUM ; 510/511

Publication date:

2006-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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