A platform for research: civil engineering, architecture and urbanism
A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications
A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications
A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications
Lin, Y. C. (author) / Zhong, J. (author)
JOURNAL OF MATERIALS SCIENCE ; 43 ; 3072-3093
2008-01-01
22 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Joining up adhesives information
British Library Online Contents | 2003
|British Library Online Contents | 1999
|Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
British Library Online Contents | 2010
|Mechanical properties of nanostructured polymer particles for anisotropic conductive adhesives
British Library Online Contents | 2007
|Acrylic Adhesives in the Polyolefins Joining
British Library Online Contents | 2008
|