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    Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder

    New search for: Nogita, K.
    New search for: Gourlay, C.M.
    New search for: Read, J.
    New search for: Nishimura, T.
    New search for: Suenaga, S.
    New search for: Dahle, A.K.

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    Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder

    New search for: Nogita, K.
    New search for: Gourlay, C.M.
    New search for: Read, J.
    New search for: Nishimura, T.
    New search for: Suenaga, S.
    New search for: Dahle, A.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder

    New search for: Nogita, K.
    New search for: Gourlay, C.M.
    New search for: Read, J.
    New search for: Nishimura, T.
    New search for: Suenaga, S.
    New search for: Dahle, A.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder

    Contributors:

    Nogita, K. (author) / Gourlay, C.M. (author) / Read, J. (author) / Nishimura, T. (author) / Suenaga, S. (author) / Dahle, A.K. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 49 ; 443-448

    Publication date:

    2008-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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