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    Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

    New search for: Bae, K.-S.
    New search for: Kim, S.-J.

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    Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

    New search for: Bae, K.-S.
    New search for: Kim, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

    New search for: Bae, K.-S.
    New search for: Kim, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints

    Contributors:

    Bae, K.-S. (author) / Kim, S.-J. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 743-746

    Publication date:

    2002-01-01

    Size:

    4 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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