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    Undercooling and microhardness of Pb-free solders on various under bump metallurgies

    New search for: Cho, M.G.
    New search for: Kang, S.K.
    New search for: Lee, H.M.

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    Undercooling and microhardness of Pb-free solders on various under bump metallurgies

    New search for: Cho, M.G.
    New search for: Kang, S.K.
    New search for: Lee, H.M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Undercooling and microhardness of Pb-free solders on various under bump metallurgies

    New search for: Cho, M.G.
    New search for: Kang, S.K.
    New search for: Lee, H.M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Undercooling and microhardness of Pb-free solders on various under bump metallurgies

    Contributors:

    Cho, M.G. (author) / Kang, S.K. (author) / Lee, H.M. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 1147-1154

    Publication date:

    2008-01-01

    Size:

    8 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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