Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders: Fid-Bau Portal

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Cho, M.G. / Kang, S.K. / Seo, S.-K. / Shih, D.-Y. / Lee, H.M.

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Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Cho, M.G. / Kang, S.K. / Seo, S.-K. / Shih, D.-Y. / Lee, H.M.

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Cho, M.G. / Kang, S.K. / Seo, S.-K. / Shih, D.-Y. / Lee, H.M.

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Document information

Title:

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Contributors:

Cho, M.G. (author) / Kang, S.K. (author) / Seo, S.-K. (author) / Shih, D.-Y. (author) / Lee, H.M. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 24 ; 534-543

Publication date:

2009-01-01

Size:

10 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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