A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies
Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies
Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies
Cho, M.G. (author) / Seo, S.-K. (author) / Lee, H.M. (author)
MATERIALS TRANSACTIONS ; 50 ; 2291-2296
2009-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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