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    Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM

    New search for: Kang, K.I.
    New search for: Jung, J.P.
    New search for: Bang, W.H.
    New search for: Park, J.H.
    New search for: Oh, K.H.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

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    Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM

    New search for: Kang, K.I.
    New search for: Jung, J.P.
    New search for: Bang, W.H.
    New search for: Park, J.H.
    New search for: Oh, K.H.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM

    New search for: Kang, K.I.
    New search for: Jung, J.P.
    New search for: Bang, W.H.
    New search for: Park, J.H.
    New search for: Oh, K.H.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM

    Contributors:

    Kang, K.I. (author) / Jung, J.P. (author) / Bang, W.H. (author) / Park, J.H. (author) / Oh, K.H. (author) / Lee, C. / Lee, J.-B. / Park, D.-H. / Na, S.-J.

    Published in:

    Advanced Welding and Micro Joining / Packaging for the 21st Century ; 177-182

    MATERIALS SCIENCE FORUM ; 580/582

    Publication date:

    2008-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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