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Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint

Tseng, H. W. / Liu, C. Y.

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Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint

Tseng, H. W. / Liu, C. Y.

Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint

Tseng, H. W. / Liu, C. Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint

Contributors:

Tseng, H. W. (author) / Liu, C. Y. (author)

Published in:

MATERIALS LETTERS ; 62 ; 3887-3889

Publication date:

2008-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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