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    Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

    New search for: Guo, Bingfeng
    New search for: Kunwar, Anil
    New search for: Zhao, Ning
    New search for: Chen, Jun
    New search for: Wang, Yunpeng
    New search for: Ma, Haitao

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    Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

    New search for: Guo, Bingfeng
    New search for: Kunwar, Anil
    New search for: Zhao, Ning
    New search for: Chen, Jun
    New search for: Wang, Yunpeng
    New search for: Ma, Haitao

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

    New search for: Guo, Bingfeng
    New search for: Kunwar, Anil
    New search for: Zhao, Ning
    New search for: Chen, Jun
    New search for: Wang, Yunpeng
    New search for: Ma, Haitao

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints

    Contributors:

    Guo, Bingfeng (author) / Kunwar, Anil (author) / Zhao, Ning (author) / Chen, Jun (author) / Wang, Yunpeng (author) / Ma, Haitao (author)

    Published in:

    Materials research bulletin ; 99 ; 239-248

    Publication date:

    2018-01-01

    Size:

    10 pages

    ISSN:

    0025-5408

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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