Formation of Ag3Sn plates in SnAgCu solder bumps: Fid-Bau Portal

Formation of Ag3Sn plates in SnAgCu solder bumps

Gong, J. / Liu, C. / Conway, P. P. / Silberschmidt, V. V.

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Formation of Ag3Sn plates in SnAgCu solder bumps

Gong, J. / Liu, C. / Conway, P. P. / Silberschmidt, V. V.

Formation of Ag3Sn plates in SnAgCu solder bumps

Gong, J. / Liu, C. / Conway, P. P. / Silberschmidt, V. V.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Formation of Ag3Sn plates in SnAgCu solder bumps

Contributors:

Gong, J. (author) / Liu, C. (author) / Conway, P. P. (author) / Silberschmidt, V. V. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 527 ; 2588-2591

Publication date:

2010-01-01

Size:

4 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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