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    Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder

    New search for: Cheng, F.J.
    New search for: Nishikawa, H.
    New search for: Takemoto, T.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

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    Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder

    New search for: Cheng, F.J.
    New search for: Nishikawa, H.
    New search for: Takemoto, T.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder

    New search for: Cheng, F.J.
    New search for: Nishikawa, H.
    New search for: Takemoto, T.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder

    Contributors:

    Cheng, F.J. (author) / Nishikawa, H. (author) / Takemoto, T. (author) / Lee, C. / Lee, J.-B. / Park, D.-H. / Na, S.-J.

    Published in:

    Advanced Welding and Micro Joining / Packaging for the 21st Century ; 239-242

    MATERIALS SCIENCE FORUM ; 580/582

    Publication date:

    2008-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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