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    Technical note Investigation of interfacial reaction between eutectic Sn-Pb solder droplet and Au/Ni/Cu pad

    New search for: Li, F.Q.
    New search for: Wang, C.Q.
    New search for: Tian, Y.H.
    New search for: Cerezo, A.
    New search for: Cockayne, D.

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    Technical note Investigation of interfacial reaction between eutectic Sn-Pb solder droplet and Au/Ni/Cu pad

    New search for: Li, F.Q.
    New search for: Wang, C.Q.
    New search for: Tian, Y.H.
    New search for: Cerezo, A.
    New search for: Cockayne, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Technical note Investigation of interfacial reaction between eutectic Sn-Pb solder droplet and Au/Ni/Cu pad

    New search for: Li, F.Q.
    New search for: Wang, C.Q.
    New search for: Tian, Y.H.
    New search for: Cerezo, A.
    New search for: Cockayne, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Technical note Investigation of interfacial reaction between eutectic Sn-Pb solder droplet and Au/Ni/Cu pad

    Contributors:

    Li, F.Q. (author) / Wang, C.Q. (author) / Tian, Y.H. (author) / Cerezo, A. / Cockayne, D.

    Published in:

    High resolution chemical mapping ; 744-750

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 24

    Publication date:

    2008-01-01

    Size:

    7 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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