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    Interfacial reactions between eutectic Sn–Pb solder and Co substrate

    New search for: Wang, C. h.
    New search for: Kuo, C. y.

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    Interfacial reactions between eutectic Sn–Pb solder and Co substrate

    New search for: Wang, C. h.
    New search for: Kuo, C. y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial reactions between eutectic Sn–Pb solder and Co substrate

    New search for: Wang, C. h.
    New search for: Kuo, C. y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Interfacial reactions between eutectic Sn–Pb solder and Co substrate

    Contributors:

    Wang, C. h. (author) / Kuo, C. y. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 46 ; 2654-2661

    Publication date:

    2011-01-01

    Size:

    8 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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