A platform for research: civil engineering, architecture and urbanism
Influence of Ga addition on Microstructure, Tensile Properties and Surface Oxide Film Characteristics of Microelectronic Sn-9Zn-xGa Solders (Express Regular Article)
Influence of Ga addition on Microstructure, Tensile Properties and Surface Oxide Film Characteristics of Microelectronic Sn-9Zn-xGa Solders (Express Regular Article)
Influence of Ga addition on Microstructure, Tensile Properties and Surface Oxide Film Characteristics of Microelectronic Sn-9Zn-xGa Solders (Express Regular Article)
Hung, F.-Y. (author) / Lui, T.-S. (author) / Chen, L.-H. (author) / Chen, P.-H. (author)
MATERIALS TRANSACTIONS ; 49 ; 1496-1502
2008-01-01
7 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2008
|Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders
British Library Online Contents | 2007
|The Recrystallization of Microelectronic Lead-Free Solders
British Library Online Contents | 2008
|Nanoindentation of lead-free solders in microelectronic packaging
British Library Online Contents | 2007
|Surface Structure of Woodceramics Manufactured from Cedar (Express Regular Article)
British Library Online Contents | 2005
|