Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders: Fid-Bau Portal

Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. / Chan, C.-W.

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Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. / Chan, C.-W.

Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. / Chan, C.-W.

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Check availability in my library

Order at Subito €

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Document information

Title:

Deformation Fracture Characteristics of Microelectronic Sn-3.0Ag-0.5Cu-xNi Solders

Contributors:

Hung, F.-Y. (author) / Lui, T.-S. (author) / Chen, L.-H. (author) / Chan, C.-W. (author)

Published in:

MATERIALS TRANSACTIONS ; 48 ; 3014-3020

Publication date:

2007-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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