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    Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

    New search for: Shohji, I.
    New search for: Watanabe, H.
    New search for: Okashita, T.
    New search for: Osawa, T.

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    Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

    New search for: Shohji, I.
    New search for: Watanabe, H.
    New search for: Okashita, T.
    New search for: Osawa, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

    New search for: Shohji, I.
    New search for: Watanabe, H.
    New search for: Okashita, T.
    New search for: Osawa, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode

    Contributors:

    Shohji, I. (author) / Watanabe, H. (author) / Okashita, T. (author) / Osawa, T. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 49 ; 1513-1517

    Publication date:

    2008-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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