Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions

    New search for: Sham, M. L.
    New search for: Kim, J. K.
    New search for: Park, J. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions

    New search for: Sham, M. L.
    New search for: Kim, J. K.
    New search for: Park, J. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions

    New search for: Sham, M. L.
    New search for: Kim, J. K.
    New search for: Park, J. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thermal performance of flip chip packages: Numerical study of thermo-mechanical interactions

    Contributors:

    Sham, M. L. (author) / Kim, J. K. (author) / Park, J. H. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 43 ; 469-480

    Publication date:

    2008-01-01

    Size:

    12 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Singular stress fields at corners in flip-chip packages

    Lu, N. / Zhang, Z. / Yoon, J. et al. | British Library Online Contents | 2012

    Optimizing maximum equivalent strain on solder balls in flip-chip packages

    Wu, G. H. / Ju, S. H. / Hsu, T. C. et al. | British Library Online Contents | 2008

    Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

    Lee, B. W. / Jang, W. / Kim, D. W. et al. | British Library Online Contents | 2004

    Effects of substrate metallizations on solder/underbump metallization interfacial reactions in flip-chip packages during thermal aging

    Zhang, F. / Li, M. / Chum, C. C. et al. | British Library Online Contents | 2003

    Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

    Yang, D. | British Library Online Contents | 2008

    Back to top