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    Low temperature electromigration and thermomigration in lead-free solder joints

    New search for: Basaran, C.
    New search for: Abdulhamid, M. F.

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    Low temperature electromigration and thermomigration in lead-free solder joints

    New search for: Basaran, C.
    New search for: Abdulhamid, M. F.

    Access

    Access via TIB
    Check availability in my library
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    Low temperature electromigration and thermomigration in lead-free solder joints

    New search for: Basaran, C.
    New search for: Abdulhamid, M. F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Low temperature electromigration and thermomigration in lead-free solder joints

    Contributors:

    Basaran, C. (author) / Abdulhamid, M. F. (author)

    Published in:

    MECHANICS OF MATERIALS ; 41 ; 1223-1241

    Publication date:

    2009-01-01

    Size:

    19 pages

    ISSN:

    0167-6636

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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