Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

    New search for: Jang, D.M.
    New search for: Yu, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

    New search for: Jang, D.M.
    New search for: Yu, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

    New search for: Jang, D.M.
    New search for: Yu, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

    Contributors:

    Jang, D.M. (author) / Yu, J. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 3032-3037

    Publication date:

    2011-01-01

    Size:

    6 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM

    Kang, K.I. / Jung, J.P. / Bang, W.H. et al. | British Library Online Contents | 2008

    Reaction between Sn-In Solder and Under Bump Metallurgy

    Choi, J. H. / Jung, B. Y. / Jun, S. W. et al. | British Library Online Contents | 2004

    Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump

    Wang, D. / Yuan, Y. / Luo, L. | British Library Online Contents | 2011

    Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

    Kim, D.-G. / Jung, S.-B. | British Library Online Contents | 2005

    Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

    Huang, C. P. / Chen, C. / Liu, C. Y. et al. | British Library Online Contents | 2005

    Back to top