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    Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives

    New search for: Tsai, J.C.
    New search for: Kao, J.F.

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    Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives

    New search for: Tsai, J.C.
    New search for: Kao, J.F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives

    New search for: Tsai, J.C.
    New search for: Kao, J.F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives

    Contributors:

    Tsai, J.C. (author) / Kao, J.F. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 594 ; 181-186

    Publication date:

    2008-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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