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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Huo, F.W. / Guo, D.M. / Kang, R.K. / Jin, Z.J.

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Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Huo, F.W. / Guo, D.M. / Kang, R.K. / Jin, Z.J.

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Huo, F.W. / Guo, D.M. / Kang, R.K. / Jin, Z.J.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers

Contributors:

Huo, F.W. (author) / Guo, D.M. (author) / Kang, R.K. (author) / Jin, Z.J. (author)

Published in:

KEY ENGINEERING MATERIALS ; 389/390 ; 36-41

Publication date:

2009-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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