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    Ultraprecision grinding of silicon wafers using a newly developed diamond wheel

    New search for: Zhou, Hongxiu
    New search for: Guo, Miao
    New search for: Wang, Xinze

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    Ultraprecision grinding of silicon wafers using a newly developed diamond wheel

    New search for: Zhou, Hongxiu
    New search for: Guo, Miao
    New search for: Wang, Xinze

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Ultraprecision grinding of silicon wafers using a newly developed diamond wheel

    New search for: Zhou, Hongxiu
    New search for: Guo, Miao
    New search for: Wang, Xinze

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Ultraprecision grinding of silicon wafers using a newly developed diamond wheel

    Contributors:

    Zhou, Hongxiu (author) / Guo, Miao (author) / Wang, Xinze (author)

    Published in:

    Materials science in semiconductor processing ; 68 ; 238-244

    Publication date:

    2017-01-01

    Size:

    7 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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