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    Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives

    New search for: Sato, R.
    New search for: Ichida, Y.
    New search for: Morimoto, Y.
    New search for: Shimizu, K.

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    Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives

    New search for: Sato, R.
    New search for: Ichida, Y.
    New search for: Morimoto, Y.
    New search for: Shimizu, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives

    New search for: Sato, R.
    New search for: Ichida, Y.
    New search for: Morimoto, Y.
    New search for: Shimizu, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives

    Contributors:

    Sato, R. (author) / Ichida, Y. (author) / Morimoto, Y. (author) / Shimizu, K. (author)

    Published in:

    KEY ENGINEERING MATERIALS ; 389/390 ; 515-520

    Publication date:

    2009-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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