Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001): Fid-Bau Portal

Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

An, J.H. / Lee, G.S. / Lee, W.J. / Shin, B.C. / Seo, J.D. / Ku, K.R. / Seo, H.D. / Jeong, H.D.

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Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

An, J.H. / Lee, G.S. / Lee, W.J. / Shin, B.C. / Seo, J.D. / Ku, K.R. / Seo, H.D. / Jeong, H.D.

Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

An, J.H. / Lee, G.S. / Lee, W.J. / Shin, B.C. / Seo, J.D. / Ku, K.R. / Seo, H.D. / Jeong, H.D.

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Document information

Title:

Effect of Process Parameters on Material Removal Rate in Chemical Mechanical Polishing of 6H-SiC(0001)

Contributors:

An, J.H. (author) / Lee, G.S. (author) / Lee, W.J. (author) / Shin, B.C. (author) / Seo, J.D. (author) / Ku, K.R. (author) / Seo, H.D. (author) / Jeong, H.D. (author)

Published in:

MATERIALS SCIENCE FORUM ; 600/603 ; 831-834

Publication date:

2009-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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