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    An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes

    New search for: Oh, S.
    New search for: Seok, J.

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    An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes

    New search for: Oh, S.
    New search for: Seok, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes

    New search for: Oh, S.
    New search for: Seok, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes

    Contributors:

    Oh, S. (author) / Seok, J. (author)

    Published in:

    WEAR -LAUSANNE- ; 266 ; 839-849

    Publication date:

    2009-01-01

    Size:

    11 pages

    ISSN:

    0043-1648

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11292

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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