Multiscale material removal modeling of chemical mechanical polishing

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2003

Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic (Silicon Nitride) and Glass (Silicon Dioxide)

Jiang, M. / Komanduri, R. | British Library Online Contents | 2001

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Su, J. X. / Guo, D. M. / Kang, R. K. et al. | British Library Online Contents | 2004

Material removal model for chemical-mechanical polishing considering wafer flexibility and edge effects

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2004

A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale

Bai, J. / Zhao, Y. W. / Wang, Y. G. | British Library Online Contents | 2007