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    Thinning Technology of Patterned Silicon Wafer for Micro Pressure Sensor

    New search for: Nagano, T.
    New search for: Touge, M.
    New search for: Watanabe, J.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

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    Thinning Technology of Patterned Silicon Wafer for Micro Pressure Sensor

    New search for: Nagano, T.
    New search for: Touge, M.
    New search for: Watanabe, J.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thinning Technology of Patterned Silicon Wafer for Micro Pressure Sensor

    New search for: Nagano, T.
    New search for: Touge, M.
    New search for: Watanabe, J.
    New search for: Tamaki, J.
    New search for: Kuriyagawa, T.
    New search for: Baron, Y. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thinning Technology of Patterned Silicon Wafer for Micro Pressure Sensor

    Contributors:

    Nagano, T. (author) / Touge, M. (author) / Watanabe, J. (author) / Tamaki, J. / Kuriyagawa, T. / Baron, Y. M.

    Published in:

    Advances in Abrasive Technology VIII ; 419-424

    KEY ENGINEERING MATERIALS ; 291/292

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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