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Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Durairaj, R. / Ramesh, S. / Mallik, S. / Seman, A. / Ekere, N.

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Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Durairaj, R. / Ramesh, S. / Mallik, S. / Seman, A. / Ekere, N.

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Durairaj, R. / Ramesh, S. / Mallik, S. / Seman, A. / Ekere, N.

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Order at Subito €

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Document information

Title:

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Contributors:

Durairaj, R. (author) / Ramesh, S. (author) / Mallik, S. (author) / Seman, A. (author) / Ekere, N. (author)

Published in:

MATERIALS AND DESIGN -REIGATE- ; 30 ; 3812-3818

Publication date:

2009-01-01

Size:

7 pages

ISSN:

0264-1275

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.0042

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