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    Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

    New search for: Amalu, E.H.
    New search for: Ekere, N.N.
    New search for: Mallik, S.

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    Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

    New search for: Amalu, E.H.
    New search for: Ekere, N.N.
    New search for: Mallik, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

    New search for: Amalu, E.H.
    New search for: Ekere, N.N.
    New search for: Mallik, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

    Contributors:

    Amalu, E.H. (author) / Ekere, N.N. (author) / Mallik, S. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 32 ; 3189-3197

    Publication date:

    2011-01-01

    Size:

    9 pages

    ISSN:

    0264-1275

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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