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    Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

    New search for: Hu, X.
    New search for: Song, Z.
    New search for: Pan, Z.
    New search for: Liu, W.
    New search for: Wu, L.

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    Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

    New search for: Hu, X.
    New search for: Song, Z.
    New search for: Pan, Z.
    New search for: Liu, W.
    New search for: Wu, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

    New search for: Hu, X.
    New search for: Song, Z.
    New search for: Pan, Z.
    New search for: Liu, W.
    New search for: Wu, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Planarization machining of sapphire wafers with boron carbide and colloidal silica as abrasives

    Contributors:

    Hu, X. (author) / Song, Z. (author) / Pan, Z. (author) / Liu, W. (author) / Wu, L. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 255 ; 8230-8234

    Publication date:

    2009-01-01

    Size:

    5 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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