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    Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints

    New search for: He, H.
    New search for: Xu, G.
    New search for: Guo, F.

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    Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints

    New search for: He, H.
    New search for: Xu, G.
    New search for: Guo, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints

    New search for: He, H.
    New search for: Xu, G.
    New search for: Guo, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints

    Contributors:

    He, H. (author) / Xu, G. (author) / Guo, F. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 45 ; 929-935

    Publication date:

    2010-01-01

    Size:

    7 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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