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    Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

    New search for: Wang, Fengjiang
    New search for: Liu, Luting
    New search for: Zhou, Lili
    New search for: Wang, Jiheng
    New search for: Wu, Mingfang
    New search for: Wang, Xiaojing

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    Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

    New search for: Wang, Fengjiang
    New search for: Liu, Luting
    New search for: Zhou, Lili
    New search for: Wang, Jiheng
    New search for: Wu, Mingfang
    New search for: Wang, Xiaojing

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

    New search for: Wang, Fengjiang
    New search for: Liu, Luting
    New search for: Zhou, Lili
    New search for: Wang, Jiheng
    New search for: Wu, Mingfang
    New search for: Wang, Xiaojing

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration

    Contributors:

    Wang, Fengjiang (author) / Liu, Luting (author) / Zhou, Lili (author) / Wang, Jiheng (author) / Wu, Mingfang (author) / Wang, Xiaojing (author)

    Published in:

    Materials transactions ; 58 ; 1593-1600

    Publication date:

    2017-01-01

    Size:

    8 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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