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    Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate

    New search for: Zhang, Q.
    New search for: Zou, H.
    New search for: Zhang, Z.-F.

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    Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate

    New search for: Zhang, Q.
    New search for: Zou, H.
    New search for: Zhang, Z.-F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate

    New search for: Zhang, Q.
    New search for: Zou, H.
    New search for: Zhang, Z.-F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate

    Contributors:

    Zhang, Q. (author) / Zou, H. (author) / Zhang, Z.-F. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 303-314

    Publication date:

    2010-01-01

    Size:

    12 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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