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Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiC~p/Al Composites
Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiC~p/Al Composites
Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiC~p/Al Composites
Wu, M. (author) / He, X.B. (author) / Ren, S.B. (author) / Qin, M.L. (author) / Qu, X.H. (author) / Chandra, T. / Wanderka, N. / Reimers, W. / Ionescu, M.
2010-01-01
10 pages
Article (Journal)
English
DDC:
620.11
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