The Morphology and Evolution of Cu~6Sn~5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging: Fid-Bau Portal

The Morphology and Evolution of Cu~6Sn~5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

Wang, Y.L. / Zhang, K.K. / Li, C.Y. / Han, L.J.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

The Morphology and Evolution of Cu~6Sn~5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

Wang, Y.L. / Zhang, K.K. / Li, C.Y. / Han, L.J.

The Morphology and Evolution of Cu~6Sn~5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

Wang, Y.L. / Zhang, K.K. / Li, C.Y. / Han, L.J.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

The Morphology and Evolution of Cu~6Sn~5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

Contributors:

Wang, Y.L. (author) / Zhang, K.K. (author) / Li, C.Y. (author) / Han, L.J. (author) / Niu, J. / Zhou, G.

Published in:

Physical and Numerical Simulation of Material Processing VI ; 685-689

MATERIALS SCIENCE FORUM ; 704/705

Publication date:

2012-01-01

Size:

5 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Zhang, K.K. / Wang, Y.L. / Fan, Y.L. et al. | British Library Online Contents | 2010

Formation of interfacial eta '-Cu~6Sn~5 in Sn-0.7Cu/Cu solder joints during isothermal aging

Luo, Z. / Wang, L. / Fu, Q. et al. | British Library Online Contents | 2011

Microstructure Evolution of Sn-2.5Ag-2.0Ni Solder Joint with Various Ni Platings on SiC~p/Al Composites

Wu, M. / He, X.B. / Ren, S.B. et al. | British Library Online Contents | 2010

Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

Shi, X. Q. / Kwan, H. F. / Nai, S. M. et al. | British Library Online Contents | 2004

Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

Fu, Y. / Zhang, Q. / Sun, F. et al. | British Library Online Contents | 2007