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Characteristics of Gold Wire Bonds with Ti- and Ni-Based Contact Metallization to n-SiC for High Temperature Applications
Characteristics of Gold Wire Bonds with Ti- and Ni-Based Contact Metallization to n-SiC for High Temperature Applications
Characteristics of Gold Wire Bonds with Ti- and Ni-Based Contact Metallization to n-SiC for High Temperature Applications
Guziewicz, M. (author) / Kisiel, R. (author) / Golaszewska, K. (author) / Wzorek, M. (author) / Stonert, A. (author) / Piotrowska, A. (author) / Szmidt, J. (author) / Bauer, A.J. / Friedrichs, P. / Krieger, M.
2010-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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