Damage mechanisms during lapping and mechanical polishing CdZnTe wafers: Fid-Bau Portal

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Li, Y. / Kang, R. / Gao, H. / Wu, D.

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Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Li, Y. / Kang, R. / Gao, H. / Wu, D.

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Li, Y. / Kang, R. / Gao, H. / Wu, D.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Contributors:

Li, Y. (author) / Kang, R. (author) / Gao, H. (author) / Wu, D. (author)

Published in:

RARE METALS -BEIJING- ENGLISH EDITION ; 29 ; 276-279

Publication date:

2010-01-01

Size:

4 pages

ISSN:

1001-0521

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669

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