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    Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

    New search for: Tsukamoto, H.
    New search for: Nishimura, T.
    New search for: Suenaga, S.
    New search for: Nogita, K.

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    Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

    New search for: Tsukamoto, H.
    New search for: Nishimura, T.
    New search for: Suenaga, S.
    New search for: Nogita, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

    New search for: Tsukamoto, H.
    New search for: Nishimura, T.
    New search for: Suenaga, S.
    New search for: Nogita, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates

    Contributors:

    Tsukamoto, H. (author) / Nishimura, T. (author) / Suenaga, S. (author) / Nogita, K. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B ADVANCED FUNCTIONAL SOLID STATE MATERIALS ; 171 ; 162-171

    Publication date:

    2010-01-01

    Size:

    10 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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