Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme: Fid-Bau Portal

Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme

Che, M.-L. / Huang, C.-Y. / Choang, S. / Chen, Y.-H. / Leu, J.

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Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme

Che, M.-L. / Huang, C.-Y. / Choang, S. / Chen, Y.-H. / Leu, J.

Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme

Che, M.-L. / Huang, C.-Y. / Choang, S. / Chen, Y.-H. / Leu, J.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme

Contributors:

Che, M.-L. (author) / Huang, C.-Y. (author) / Choang, S. (author) / Chen, Y.-H. (author) / Leu, J. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 1049-1056

Publication date:

2010-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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