Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Moisture uptake and dielectric property of methylsilsesquioxane/high-temperature porogen hybrids and porous low-k films

    New search for: Che, M.-L.
    New search for: Teng, J.-Y.
    New search for: Lai, P.-C.
    New search for: Leu, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Moisture uptake and dielectric property of methylsilsesquioxane/high-temperature porogen hybrids and porous low-k films

    New search for: Che, M.-L.
    New search for: Teng, J.-Y.
    New search for: Lai, P.-C.
    New search for: Leu, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Moisture uptake and dielectric property of methylsilsesquioxane/high-temperature porogen hybrids and porous low-k films

    New search for: Che, M.-L.
    New search for: Teng, J.-Y.
    New search for: Lai, P.-C.
    New search for: Leu, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Moisture uptake and dielectric property of methylsilsesquioxane/high-temperature porogen hybrids and porous low-k films

    Contributors:

    Che, M.-L. (author) / Teng, J.-Y. (author) / Lai, P.-C. (author) / Leu, J. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 2987-2995

    Publication date:

    2011-01-01

    Size:

    9 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermal and mechanical properties of hybrid methylsilsesquioxane/poly(styrene-b-4-vinylpyridine) low-k dielectrics using a late porogen removal scheme

    Che, M.-L. / Huang, C.-Y. / Choang, S. et al. | British Library Online Contents | 2010

    Lower temperature and shorter curing time of methylsilsesquioxane for intermetal dielectric application

    Chua, C. T. / Sarkar, G. / Chool, S. Y. M. et al. | British Library Online Contents | 1998

    Spin-on-polymer methylsilsesquioxane for sub-micron intermetal dielectric application

    Chua, C. T. / Sarkar, G. / Chooi, S. Y. M. et al. | British Library Online Contents | 1999

    Patterned nanoporous poly(methylsilsesquioxane) thin films: a potential high density substrate

    Hogan, Z. L. / Kreller, C. R. / Tran, K. A. et al. | British Library Online Contents | 2004

    Porogen concentration and its desorbing temperature dependence in porous silica film incorporated with ethylene groups

    Uchida, Y. / Ito, Y. / Ishida, K. | British Library Online Contents | 2005

    Back to top