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    Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

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    New search for: Guo, J.
    New search for: Gu, X.
    New search for: Zhao, X.
    New search for: Liu, X.

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    Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

    New search for: Zeng, Q.
    New search for: Guo, J.
    New search for: Gu, X.
    New search for: Zhao, X.
    New search for: Liu, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

    New search for: Zeng, Q.
    New search for: Guo, J.
    New search for: Gu, X.
    New search for: Zhao, X.
    New search for: Liu, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

    Contributors:

    Zeng, Q. (author) / Guo, J. (author) / Gu, X. (author) / Zhao, X. (author) / Liu, X. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 26 ; 156-162

    Publication date:

    2010-01-01

    Size:

    7 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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