TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate: Fid-Bau Portal

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B.

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Contributors:

Yoon, J. W. (author) / Jung, S. B. (author) / Kim, H. S. / Li, Y. B. / Lee, S. W.

Published in:

Eco-Materials Processing & Design VII: Proceedings of the Conference of the 7^t^h International Symposium on Eco-Materials Processing & Design January 8-11, 2006, Chengdu, China ; 554-557

MATERIALS SCIENCE FORUM ; 510/511

Publication date:

2006-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. et al. | British Library Online Contents | 2008

Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints

Yoon, J. W. / Chun, H. S. / Jung, S. B. | British Library Online Contents | 2008

Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder

Zhao, J. / Miyashita, Y. / Mutoh, Y. | British Library Online Contents | 2001

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

Nishikawa, H. / Komatsu, A. / Takemoto, T. | British Library Online Contents | 2008

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B. | British Library Online Contents | 2005