Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate: Fid-Bau Portal

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Zeng, Q. / Guo, J. / Gu, X. / Zhao, X. / Liu, X.

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Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Zeng, Q. / Guo, J. / Gu, X. / Zhao, X. / Liu, X.

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Zeng, Q. / Guo, J. / Gu, X. / Zhao, X. / Liu, X.

Zugriff

Zugriff über TIB

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Bestellung bei Subito €

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Titel:

Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate

Beteiligte:

Zeng, Q. (Autor:in) / Guo, J. (Autor:in) / Gu, X. (Autor:in) / Zhao, X. (Autor:in) / Liu, X. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 26 ; 156-162

Erscheinungsdatum:

01.01.2010

Format / Umfang:

7 pages

ISSN:

1005-0302

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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